Thermal Grizzly CPU Kühler - Seite 6

Thermally conductive gap filler to replace GPU thermal pads, with an operating temperature range of -40°C to +120°C.

TG Putty is a thermally conductive compound intended for GPU applications, offered in multiple sizes and performance variants.

• Replaces standard GPU thermal pads to bridge uneven surfaces


• Operating temperature: -40°C to +120°C


• Available contents: 30 g and 100 g


• Available variants: Basic, Advance, Pro


• Datasheet and technical information available for download

Ensures reliable thermal contact across gaps to support heat transfer between GPU components.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Die AM5 M4 Backplate ist eine optionale Montageplatte, welche die original AM5-Backplate ersetzt. Einige CPU-Kühler verwenden ein Montage-Kit, das mit Schrauben mit M4-Gewinde ausgeliefert wird. Diese sind nicht mit dem UNC 6-32-Gewinde kompatibel, dass bei der AM5-Backplate verwendet wird. Mit der AM5 M4 Backplate können entsprechende CPU-Kühler, besonders AiO-Wasserkühlungen, verwendet werden.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity


• Easy to use


• Consistently high performance


• Extreme durability
  
  

Attention: Electrically conductive! Follow instructions!

Der Hitzeverteiler der Ryzen-7000-Prozessoren ist sehr dick, was teilweise auf die Kompatibilität mit älteren CPU-Kühlern für den AM4-Sockel zurückzuführen ist. Die unnötige Dicke des Hitzeverteilers reduziert die Wärmeleitfähigkeit, so dass die CPUs bei sehr hohen Temperaturen von etwa 95 Grad Celsius arbeiten. Durch Entfernen des Hitzeverteilers ("Decap", "Delidding") kann der CPU-Kühler direkt auf den Chiplets des Ryzen-7000-CPU montiert werden, was die Temperaturen drastisch reduziert. Um Schäden an empfindlichen Chips zu vermeiden und Betriebsprobleme (z.B. RAM) zu verhindern, ersetzt das Ryzen-7000-Direct-Die-Rahmen den Socket-Aktivierungsmechanismus (SAM) auf dem Motherboard.

Thermo-Pad, Red Brown

Thermo-Pad, Red Brown

Thermo-Pad, Red Brown

Thermo-Pad, Red Brown

Thermal pad delivering excellent thermal conductivity and outstanding compressibility for efficient heat transfer in SSDs, GPU coolers and other electronic components.

The Minus Pad Pro is an electrically non-conductive thermal pad developed to improve thermal conductivity and compressibility while remaining easy to apply.

• Excellent thermal conductivity


• Outstanding compressibility for reliable contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Easy-to-use design ensures consistent thermal contact across a range of cooling and electronic applications.

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply.

The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules.

• Excellent thermal conductivity for efficient heat transfer


• Outstanding compressibility for tight-gap filling


• Electrically non-conductive for safe use on electronics


• Easy to use and install


• Color: gray

Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended