Thermal Grizzly CPU Kühler - Seite 2

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1 × Duronaut thermal paste 2 g
1 × Applicator
1 × TG Spatula
1 × TG Spatula Pro

Der AM5 High Performance Heatspreader ist ein Upgrade für die Ryzen 7000 CPUs von AMD. Die diamantgefräste Präzisionsoberfläche des Heatspreaders aus vernickeltem Kupfer bietet eine 240% größere Oberfläche. Dadurch ermöglicht der AM5 Heatspreader die maximale Wärmeabfuhr bei Luft- und Wasserkühlern.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Wärmeleitpaste für Prozessorkühler, Silber

Fettspachtel (Packung mit 3)

Thermo-Pad, Red Brown

Thermo-Pad, Red Brown

Wärmeleitpad bietet eine außergewöhnlich hohe Kompressibilität mit hervorragender Wärmeleitfähigkeit und ist dafür ausgelegt, unterschiedliche Höhenunterschiede über mehrere Kontaktpunkte zu überbrücken.

TG Minus Pad High Compression ist besonders praktisch beim Modifizieren von Grafikkarten mit einem GPU-Wasserkühler oder beim Ersetzen von Wärmeleitpads an einem GPU-Kühler, da ein Pad-Typ Komponenten wie VRAM, Spannungsregler und andere Kontaktflächen im selben Setup abdecken kann.

• Sehr hohe Kompressibilität
• Hervorragende Wärmeleitfähigkeit, auch bei starker Kompression
• Passt sich gut an Höhentoleranzen an
• Elektrisch nicht leitfähig
• Einfach zu handhaben

Ideal, wenn die exakte Pad-Dicke ungewiss ist, und hilft, zuverlässigen Kontakt aufrechtzuerhalten, während Toleranzen ausgeglichen werden.

Thermal pads with improved thermal conductivity, high compressibility and electrical insulation for effective heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Advance pads are easy to use and were developed from the Minus Pad 8 to deliver improved thermal conductivity and higher compressibility.

• Excellent thermal conductivity


• High compressibility for better surface contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Improved price-performance ratio

Designed to provide reliable heat transfer and gap filling across a range of PC and electronic cooling applications.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal pads provide improved thermal conductivity and high compressibility for efficient heat transfer in SSDs, GPU coolers, water coolers and other electronic components.

The electrically non-conductive Minus Pad Advance builds on the proven Minus Pad 8 design and was developed to improve thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• High compressibility for uneven surfaces


• Easy to apply and handle


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed for straightforward installation, these pads help maintain effective thermal contact across a range of PC and electronics cooling applications.

Thermal pads offer improved thermal conductivity, high compressibility and electrical insulation for reliable heat transfer on SSDs, GPU coolers and other electronic components.

The Minus Pad Advance series refines the proven Minus Pad 8 formula with enhanced thermal performance and easier handling, making it suitable for SSDs, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive for safe component contact


• Excellent thermal conductivity to aid heat dissipation


• High compressibility for better surface conformity


• Easy to use on a variety of cooling applications

Designed to improve heat transfer in compact cooling setups while remaining simple to apply.

Thermo-Pad, Red Brown

Thermal Grizzly TG Shield ist eine Hochtemperatur-Konformbeschichtung zum Schutz von Komponenten vor Kurzschlüssen durch Flüssigmetall. TG Shield trocknet schnell für eine schnelle Anwendung und bietet in Kombination mit Flüssigmetall zuverlässigen Schutz von PC-Komponenten.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

Thermo-Pad, Red Brown

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Thermo-Pad, Red Brown

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity

Wärmeleitpad Thermal Grizzly Minus Pad extreme 2 bietet herausragende Wärmeleitfähigkeit mit niedrigem thermischen Übergangswiderstand für Hochleistungsanwendungen.

Thermal Grizzly Minus Pad extreme 2 ist dafür entwickelt, selbst kleinste Spalte in der Matrix mit einer Mischung aus Aluminiumoxid, Aluminiumhydroxid und Aluminiumpulver zu füllen und so eine optimale Wärmeübertragung zwischen Wärmequelle und Kühler zu unterstützen. Seine weiche Konsistenz passt sich Kontaktflächen gut an, ist elektrisch nicht leitend und härtet oder verfestigt sich im Laufe der Zeit nicht, auch bei längerer Nutzung.

• Herausragende Wärmeleitfähigkeit
• Niedriger thermischer Übergangswiderstand für optimale Wärmeübertragung
• Weiches Pad passt sich den Oberflächen von Wärmequelle und Kühler an
• Elektrisch nicht leitend
• Härtet oder verfestigt sich im Laufe der Zeit nicht

Zuverlässiges Wärmeleit-Interface-Material für stabile Leistung in anspruchsvollen Kühl-Setups.

Thermo-Pad, Red Brown (Packung mit 2 )

Wärmeleitpaste Thermal Grizzly Duronaut Pro bietet hervorragende Wärmeleitfähigkeit, extreme Langzeitstabilität, elektrisch nicht leitende Anwendung und keine Aushärtung im Laufe der Zeit.

Duronaut Pro ist eine High-End-Wärmeleitpaste, entwickelt für Gamer, Overclocker und anspruchsvolle industrielle Kühlsysteme, mit Silikonöl sowie Aluminium-Mikropulver und Zinkoxid-Nanopulver.

• Minimiert den Pump-out-Effekt durch optimierte Partikelform und -größe
• Unterstützt dünne Auftragsschichten für geringen thermischen Kontaktwiderstand
• Inklusive Applikator, TG Spatula und TG Spatula Pro
• Inhalt: 2 g

Für effiziente Wärmeübertragung zwischen Wärmequelle und Kühler entwickelt, hilft Duronaut Pro, die zuverlässige Kühlleistung über die Zeit aufrechtzuerhalten.

Wärmeleitpaste, Thermal Grizzly Duronaut Pro 6g, kombiniert hervorragende Wärmeleitfähigkeit, extreme Langzeitstabilität, elektrische Nichtleitfähigkeit und keine Aushärtung im Laufe der Zeit für anspruchsvolle PC- und industrielle Kühlsysteme.

Das speziell entwickelte Silikonöl, Aluminium-Mikropulver und Zinkoxid-Nanopulver helfen, den Pump-out-Effekt zu minimieren, die Haftung auf der Oberfläche zu verbessern und den thermischen Kontaktwiderstand zu reduzieren.

Das Paket enthält Duronaut Pro 6g, einen Applikator, TG Spatula und TG Spatula Pro für effizientes Verteilen in dünnen Auftragsschichten.

Ideal für Gamer, Overclocker und anspruchsvolle Kühl-Setups, die eine langlebige, effiziente Wärmeübertragung zwischen CPU und Kühler benötigen.